The high-level self-reliance and self-improvement of semiconductor technology is reflected not only in the "self-reliance" problem of microelectronics (integrated circuit) technology under the blockade of the United States and the West, but also in the "self-improvement" problem of how optoelectronic technology can build a strong foundation and form industrial breakthroughs. The pioneering breakthrough in the optoelectronic information industry can provide strong support, cooperation, and a more favorable international competitive environment for the microelectronics (integrated circuit) industry.

The implementation of control measures for metal gallium and gallium based semiconductor materials demonstrates that China has certain resource and material advantages in this field. However, a more strategic task is how to seize the commanding heights of gallium based semiconductor technology, further strengthen the strengths of China's optoelectronic chips, and enhance the international competitiveness of China's optoelectronic information industry.

The development of "gallium system" semiconductor technology is of great strategic significance for seizing the commanding heights of the new generation of semiconductor technology

The "gallium system" semiconductor science has rich connotations and plays a key foundational role in building strong optoelectronic chip long boards

The traditional concept of "gallium system" semiconductor materials and devices is basically independent packaging and discrete components in the system, including devices that play a key role in many fields, such as semiconductor lasers, detectors, power amplifiers, low-noise amplifiers, light-emitting diodes, etc. The broad concept of "gallium system" semiconductor emphasizes more on "system" or even "ecology", emphasizes the concept of "heterogeneous" integration and related technologies, and can also integrate advanced integrated circuit chips and manufacturing technologies.

The development of "gallium system" semiconductor technology is of great strategic significance for China to seize the commanding heights of the new generation semiconductor technology

Currently, the development of integrated circuit chips based on silicon systems is the most mature and has formed a complete system ecosystem. However, the silicon system is the system ecology in which the United States and the West hold the discourse power, and China's use of advanced equipment, manufacturing technology, and electronic design automation (EDA) tools will be strictly restricted. To gradually reverse China's passive situation in the field of integrated circuit chips, on the one hand, it is necessary to have a bottom line awareness, closely follow in the integrated circuit track, and proactively strengthen the construction of integrated circuit basic capabilities, gradually lighting up the "lighthouse" of independent and self strengthening integrated circuit technology; On the other hand, it is necessary to have a long-term perspective and identify areas with advantageous foundations to lay out new tracks, in order to seize the technological high ground of competition in the new generation of semiconductors. Vigorously developing "gallium system" semiconductor technology and forming "system" and "ecology" will help China establish a leading advantage on the new track.

China's "gallium system" semiconductor technology has independent and controllable capabilities, and has the material foundation to seize the technological high ground

For a long time, the United States and the West, which are leaders in the silicon system, have not had a strong willingness and insufficient motivation to develop "gallium system" semiconductor technology. China's "gallium system" semiconductor technology has been closely followed, and the gap with the United States and the West is relatively small. Taking the Institute of Semiconductors of the Chinese Academy of Sciences as an example, from the early GaAs lasers and GaN lasers to the recent high-performance GaSb infrared detectors and lasers, as well as GaN blue light-emitting diodes, the depth and level of its scientific and technological work can also basically be in the "parallel" ranks with the world-class R&D institutions. Of particular note, China has also established a new national system that has been effective in tackling key core technologies. In addition, the characteristic of "gallium system" semiconductor technology is that it can manufacture high-performance devices without relying on manufacturing technology of *************, and there is no problem of being stuck in the field of integrated circuits by advanced lithography machines.

The "gallium system" semiconductor supports intelligent integration of sensing, computing, and transmission within a wide range of electromagnetic wave spectra as a terminal chip

Evolving from traditional separation of perception and computation to intelligent integration of terminal perception, computation, and transmission is an effective solution to solve the problem of large data latency and weak network risk resistance in cloud computing. On site programmable logic gate arrays, artificial intelligence hardware accelerators, data converters, digital signal processing, etc. must be integrated into a single package with gallium based semiconductor chips responsible for situational awareness and data transmission, supported by efficient power management chips to enhance the autonomy, multitasking flexibility, and reduce size, weight, and power consumption of intelligent terminal systems. Unlike the traditional design concept of relatively mature discrete devices that only focus on optimizing material and component performance individually, gallium based semiconductors place more emphasis on system collaborative optimization and reconfigurable platform thinking.

The "gallium system" semiconductor supports high-speed photon transceiver devices, which is expected to completely solve the bottleneck problem of massive data and bandwidth transmission in cloud based high computing power chips

Cloud computing centers are currently facing increasingly serious data transmission bottlenecks, which are expected to be solved through co encapsulation optical technology. CPO tightly integrates high-speed semiconductor lasers and high-speed optical interface components into an integrated high-performance photon transceiver device, and integrates heterogeneous packaging with high computing power chips to provide efficient long-distance and large bandwidth data transmission for the massive data required by high computing power chips. Compared to copper wires on traditional circuit boards, "gallium based" semiconductor technology can provide significantly improved data transfer rates and extremely low data power consumption - existing results have shown that a single small chip produces data throughput of T bits per second, with energy consumption of only 5 picojiaos per bit.

The ultimate form of "gallium system" semiconductors will be multi heterojunction quantum structures constructed by stacking various materials at the atomic level, and can be used to prepare disruptive optoelectronic intelligent co fusion chips

At present, some rapidly developing new material growth technologies are expected to achieve heterogeneous stacking of various high-quality "gallium system" semiconductor materials at the nanoscale, achieving the desired integration of multiple material characteristics in a single device, in order to break through the design trade-off of traditional single materials. This will provide disruptive new material characteristics, and electronic, optoelectronic, quantum, magnetic and other devices will benefit from this "revolution". For example, there have been reports of materials stacked with multiple layers of gallium nitride channels, which is sufficient to support 3D multi-channel field-effect transistors with side gates to achieve extremely low on resistance.

For a long time, China's semiconductor research and industry development has always faced various major difficulties, such as inadequate implementation of top-level planning, lagging basic research and patent layout, constraints on core equipment and manufacturing technology, and disconnection between scientific research and industry.

Fully leverage the organizational role of national scientific research institutions, and collaborate with domestic research-oriented universities and technology leading enterprises to carry out top-level design, overall planning, and joint research and development of "gallium system" semiconductor technology

The organization has the most powerful "gallium system" semiconductor technology force in the entire chain from physical principles, materials, devices, equipment, products to engineering applications, solidly condensing key scientific issues and research goals, and constructing a new scientific research paradigm for "gallium system" semiconductor technology. This paradigm innovation has not yet been clearly proposed by the United States and the West; Therefore, it is necessary to make a good first move, carry out top-level planning as soon as possible, steadily advance, and implement in an orderly manner. From a planning perspective, ensure that research institutions can change their traditional "bulk" project awareness during the research and development process, and technology enterprises can transform their short-term mindset of "treating headaches and feet with pain". Quickly forming the research and industrial advantages of China's "gallium system" semiconductor to enhance our competitiveness and bargaining chips with the United States and the West.

We attach great importance to basic research, starting from the source of semiconductor quantum physics and EDA tools in the "gallium system", and proactively prepare for patent layout

As a relatively new material system, the research on gallium based semiconductors is relatively insufficient and incomplete. Many assumptions about material properties have not been theoretically or experimentally tested, nor have they been fully evaluated or proven. Understanding the basic characteristics of material systems through theoretical simulation, prediction, and benchmark testing is crucial for determining how to further develop device manufacturing. The development and improvement of autonomous and controllable EDA tools based on theoretical research and experimental verification can help achieve simulation from atomic level to circuit level, significantly shorten the cycle and cost of chip development, and win time for advanced layout of patent systems.

We attach great importance to the construction of research platform capabilities based on self-developed equipment, solidify basic research on independently controllable core equipment, and fundamentally break free from being constrained by others

Due to limitations in advanced equipment, adopting outdated processes is the only choice in China's semiconductor industry in the short term. Vigorously developing the "gallium system" semiconductor manufacturing technology is an effective driving force for promoting the localization verification of independently controllable semiconductor equipment, especially for verifying domestic lithography machines and related consumables such as photoresists. At present, domestic equipment faces significant obstacles in importing mature silicon integrated circuit production lines for verification. Gallium based semiconductors currently do not have as strict requirements for equipment linewidth and reliability as silicon based systems, and can naturally form a growing partnership with domestic equipment.

Breaking through the barriers between scientific research platforms and production enterprises, and leveraging the roles of "question setters," "answer takers," and "examiners" of technology leading enterprises in the optoelectronic information industry

Gallium based semiconductors should learn from advanced silicon manufacturing processes, introduce large-sized and low-cost silicon substrate platforms that production enterprises are willing to accept, as well as advanced process modules such as large-sized and small linewidth lithography, chemical mechanical polishing, and planar multi-level copper interconnection. This approach helps to bridge the barriers between scientific research platforms and production enterprises, and is conducive to achieving high-yield, high-performance, and low-cost production. Research platforms should actively open platform foundry resources to domestic design enterprises in the form of multi project wafers (MPWs), provided that they share common rights to intellectual property (IP) of innovative designs. Close cooperation between scientific research platforms and technology enterprises is aimed at achieving rapid iteration and advancement of the entire chain of gallium based semiconductor technology, from design to manufacturing, testing, and application.